The latest research study “Semiconductor Wafer Polishing and Grinding Equipment Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2022-2027” by IMARC Group
The global semiconductor wafer polishing and grinding equipment market size reached US$ 385.44 Million in 2021. Looking forward, IMARC Group expects the market to reach a value of US$ 533.28 Million by 2027 exhibiting a CAGR of 5.40% during 2022-2027.
Semiconductor wafer polishing and grinding equipment refer to advanced and indispensable components utilized during the semiconductor wafer fabricating procedure. They mostly rely on end-user customization and packaging requirements. Some of the standard methods performed using semiconductor wafer polishing and grinding equipment are lithography, deposition, ion implant, etching, and cleaning. They aid in removing unwarranted material from a film and refining and thinning the product while ensuring a smooth and damage-free surface. Consequently, semiconductor wafer polishing and grinding equipment models are extensively used in foundries, memory manufacturers, integrated database management systems (IDMs), etc.
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Semiconductor Wafer Polishing and Grinding Equipment Market Trends and Drivers:
The expanding electronics industry and the increasing demand for microelectromechanical systems (MEMS), integrated circuits, and microchips to manufacture several consumer electronic goods, such as laptops, smartphones, and desktops, are primarily driving the semiconductor wafer polishing and grinding equipment market.
Besides this, the growing technological advancements, including the employment of chemical-mechanical-polishing (CMP) solutions and metal-oxide-semiconductor (MOS) to maintain the wafer surface profile during production processes, are acting as significant growth-inducing factors. Furthermore, the rising integration of artificial intelligence (AI), the internet of things (IoT), and other wireless technologies to help manufacturers engineer smart devices is also positively influencing the market growth.
Additionally, the shifting preferences for miniaturized electronic devices with thinner wafers and the elevating product adoption in wafer fabrication plants for manufacturing a system on a chip (SoC) dice are anticipated to propel the semiconductor wafer polishing and grinding equipment market in the coming years.
Covid-19 Impact:
We are regularly tracking the direct effect of COVID-19 on the market, along with the indirect influence of associated industries. These observations will be integrated into the report.
| Semiconductor Wafer Polishing and Grinding Equipment Market Report Scope | |
| Report Coverage | Details |
| Market size value in 2021 | US$ 385.44 Million |
| Market forecast in 2027 | US$ 533.28 Million |
| Growth Rate | CAGR of 5.40% from 2022 to 2027 |
| Base year for estimation | 2021 |
| Historical data | 2016-2021 |
| Forecast period | 2022-2027 |
| Report coverage | Revenue forecast, company ranking, competitive landscape, growth factors, and trends |
| Segments covered | Type and End User. |
| Regional scope | North America, Europe, Asia-Pacific, Latin America, Middle East and Africa |
| Key companies profiled | Accretech (Europe) Gmbh (Tokyo Seimitsu Co. Ltd.), Amtech Systems Inc., Axus Technology, BBS Kinmei Co Ltd, Disco Corporation, Dynavest Pte Ltd, Ebara Corporation, Gigamat Technologies Inc., Lapmaster Wolters GmbH (Lapmaster International LLC), Logitech International S.A., Okamoto Machine Tool Works Ltd and Revasum Inc. |
| Market Dynamics | Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID 19 impact and future consumer dynamics, market condition analysis for forecast period, |
| Customization purview | If our report has not included the data that you are looking for, you can reach out to our analysts and get segments customized. |
Report Segmentation:
The report has been segmented the market into following categories:
Breakup by Type:
- Semiconductor Wafer Polishing Equipment
- Semiconductor Wafer Grinding Equipment
Breakup by End User:
- Foundries
- Memory Manufacturers
- IDMs
- Others
Breakup by Region:
- North America: (United States, Canada)
- Asia Pacific: (China, Japan, India, South Korea, Australia, Indonesia, Others)
- Europe: (Germany, France, United Kingdom, Italy, Spain, Russia, Others)
- Latin America: (Brazil, Mexico, Others)
- Middle East and Africa
List of Major Key Players:
- Accretech (Europe) Gmbh (Tokyo Seimitsu Co. Ltd.)
- Amtech Systems Inc.
- Axus Technology
- BBS Kinmei Co Ltd
- Disco Corporation
- Dynavest Pte Ltd
- Ebara Corporation
- Gigamat Technologies Inc.
- Lapmaster Wolters GmbH (Lapmaster International LLC)
- Logitech International S.A.
- Okamoto Machine Tool Works Ltd
- Revasum Inc
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Key highlights of the report:
- Market Performance (2016-2021)
- Market Outlook (2022- 2027)
- Porter’s Five Forces Analysis
- Market Drivers and Success Factors
- SWOT Analysis
- Value Chain
- Comprehensive Mapping of the Competitive Landscape
If you need specific information that is not currently within the scope of the report, we can provide it to you as a part of the customization.
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IMARC Group is a leading market research company that offers management strategy and market research worldwide. We partner with clients in all sectors and regions to identify their highest-value opportunities, address their most critical challenges, and transform their businesses.
IMARC’s information products include major market, scientific, economic and technological developments for business leaders in pharmaceutical, industrial, and high technology organizations. Market forecasts and industry analysis for biotechnology, advanced materials, pharmaceuticals, food and beverage, travel and tourism, nanotechnology and novel processing methods are at the top of the company’s expertise.
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